C07200 - SEMI C72 - Guide for Propylene-Glycol-Mono-Methyl-Ether (PGME), Propylene-Glycol-Mono-Methyl-Ether-Acetate (PGMEA) and the Mixture 70wt% PGME/30wt% PGMEA StdTpc-Ultrapure Water the sum of the peak

the sum of the peak height Zp and the valley depth Zv are reported

This edition was approved for publication by the global Audits and Reviews Subcommittee on August 25

3DS-IC wafer edge trimming process is a key step for successful wafer thinning after the wafer bonded in the 3DS-IC process

2  Formulae are provided in Table A1-1 for calculating the surface areas of pellets

SEMI C20-0213 (Reapproved 1218)

C07200 - SEMI C72 - Guide for Propylene-Glycol-Mono-Methyl-Ether (PGME), Propylene-Glycol-Mono-Methyl-Ether-Acetate (PGMEA) and the Mixture 70wt% PGME/30wt% PGMEA StdTpc-Ultrapure Water the sum of the peakThis Standard was technically approved by the Liquid Chemicals Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 8, 2016. Available at www. semiviews. org and www. semi. org in March 2017; originally published August 2011. The purpose of this Document is to provide a guide for propylene glycol mono methyl ether (PGME), propylene glycol mono methyl ether acetate (PGMEA) and